In this paper, a co-design method and a wafer-level packaging technique of a flexible\nantenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are\nproposed. The proposed co-design method optimizes the system architecture, and can help avoid the\nuse of external matching components, resulting in the realization of a small-size system. In addition,\nthe technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin\nparylene film (5 �¼m) enables the integration of the rectifier circuits and the flexible antenna (rectenna).\nIn the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved\na maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with\nradio waves allows a misalignment of 185% against antenna size, implying that the misalignment has\na less effect on the WPT characteristics compared with electromagnetic induction.
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